We can handle 8inch (200mm) wafer size service only.

Our MPW (multi-project wafer) shuttle service involves arranging multiple customer chips on one wafer.
To make MASKs, we collect the necessary GDS data, produce the MASK, and then produce the wafer.

We currently offer two types of processes, and are planning to develop a series of other processes.

Q What wafer sizes can you handle in your service?
A We can handle 8inch (200mm) wafer size service only.

Q Can you develop or customize the process according to the customer requested specification?
A Yes, we have the experiences of joint development with the customer. It depends on the contents and the conditions.

Q How can we get the PDK ?
A Some steps including a work for the contract conclusion are needed to release the PDK to you, please contact us.

Q How much the maximum breakdown voltage of DMOS device in your serving process?
A 96V DMOS device is the maximum breakdown voltage in our process. There are 4 line-ups of DMOS device in our process.

Q Are there any thick metal options in your process?
A Yes, we can provide Cu-Plating and UTM(Under Top Metal) process options.

Q What kind of isolation structure does your process have?
A We can provide DTI(Deep Trench Isolation), Buried Layer and so on.

Q What kind of materials for the multi-layered metal wiring does your process have?
A We can provide Cu and Al wiring process. You can choose either one.

Q Do you have any IC design service?
A Unfortunately, we do not have any service for IC design support.

Q Do you have any service for chip probing test on wafer or chip to IC package assembly?
A No, we don't.

Q Do you accept to serve prototype development work only?
A No we don’t. Our foundry service is expected mass production business at our fab.

Q What procedures will be required from inquiry, prototype development, and to mass production.
A Please refer to "Service Flow" page of our web site.