Foundry Service


We offer WCSP packages with TSVs.
Since Toshiba started using TSV technology for volume production in 2007, we have met customer needs with high levels of quality and technical expertise.
* Part of the Back-end-process is handled in coordination with OSAT (outsourced semiconductor assembly and testing).

TSV Technology

Applications / TSV-based products

  1. CMOS Image Sensor; Consumer electronics, surveillance, automotive, medical, Line sensor and large-sized applications
  2. Si Interposer、Si-Package、Temporary bonding

[Image]: Typical applications

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